Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks
Publisher: Prentice Hall International

Signal integrity is an issue that must be addressed by PCB designers in order to achieve the target bit error rate (BER), especially with long traces between the switch (or framer ASIC) and the optical module on the front panel. Our well capable layout engineers can design a variety of circuit boards i.e. I don't know of a good reference that addresses all the issues. Single to multi-layers, rigid and flexible PCB, high speed signal integrity, SMT technology, through-hole technology, mixed technology, controlled impedance, power distribution, etc. PCB design is mostly about signal integrity, controlled impedance lines, EM coupling, and supply decoupling. A successful high-speed PCB must effectively integrate high speed ASIC's and other components to optimize signal integrity. Are proven in the market and our new CDR offerings provide a reference-less design that delivers the industry's lowest power consumption and latency of less than 1 ns, while solving the signal integrity problems on high density line-cards.". But due to tremendous evolution of power densities in transistors, PCB thermal management has now become a serious issue that must be considered early in the design. PCB thermal management has traditionally been seen as secondary to signal integrity. As system operating frequencies are increasing, PCB layout is becoming increasingly complex. Here's some ideas to help keep your boards cool and to let them be designed to operate at their highest specifications. Choose semiconductors with the best specifications for both electrical and thermal. Additionally we even have range of We undertake Manufacturing Rules Check (MRC) as per our typical stated principles to resolve any issues ahead of circuit board fabrication. Signal Integrity Issues and Printed Circuit Board Design, Douglas Brooks, Prentice Hall PTR, 2003 *) Signal Integrity - Simplified, Eric Bogatin, Prentice Hall PTR, 2004.